MediaTek Launches First mmWave Chipset for Seamless 5G Smartphone Connectivity – QNT Press Release

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Dimensity 1050 mmWave SoC highlights trio of new chipsets expanding MediaTek’s 5G and gaming portfolio

HSINCHUMay twenty three2022 /PRNewswire/ — MediaTek today announced the Dimensity 1050 system-on-chip [SoC]its first mmWave 5G chipset that will power the next generation of 5G smartphones with seamless connectivity, displays, gaming and power efficiency. Through dual connectivity using mmWave and sub-6GHz, the Dimensity 1050 will deliver the speeds and capacity required to provide smartphone users with an incredible experience, even in some of the most densely populated areas.

The Dimensity 1050 combines mmWave 5G and sub-6GHz to fluidly migrate between network bands, and is built on the ultra-efficient TSMC 6nm production process with an octa-core CPU. Supporting 3CC carrier aggregation on sub-6 (FR1) spectrum and 4CC carrier aggregation on mmWave (FR2) spectrum, the Dimensity 1050 will be capable of delivering up to 53 percent faster speeds and greater reach to smartphones compared to LTE + mmWave aggregation alone. The SoC integrates two premium Arm Cortex-A78 CPUs with speeds reaching 2.5 GHz and the latest Arm Mali-G610 graphics engine.

“The Dimensity 1050, and its combination of sub-6GHz and mmWave technologies, will deliver end-to-end 5G experiences, uninterrupted connectivity and superior power efficiency to meet everyday user demands,” said CH Chen, Deputy General Manager of …

Full story available on Benzinga.com

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