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Hsinchu, December 27, 2021 /PRNewswire/-The development of artificial intelligence and 5G has promoted the demand for high-end semiconductor chips.To improve key capabilities Taiwanese For the chip industry in this emerging market, the Ministry of Industry and Technology (DoIT), the Ministry of Economic Affairs (MOEA), Taiwan, To support the Industrial Technology Research Institute to establish the Heterogeneous Integrated Chiplet System Packaging Alliance (Hi-CHIP). The alliance will help build a complete ecosystem covering packaging design, test verification, and pilot production, so as to achieve the goal of supply chain localization and expand business opportunities.
According to DoIT, the global semiconductor industry is keen to develop heterogeneous chip integration processes, but…
The full story can be found on Benzinga.com
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