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DUBLIN, July 8, 2022 /PRNewswire/ — The “Bonding Sheet Market by Adhesive Material (Polyesters, Polyimides, Acrylics, Modified Epoxies), Application and Region – Global Forecast to 2027” report has been added to ResearchAndMarkets.com’s offering.
The global bonding sheet market size is projected to grow from USD 386 million in 2022 to USD 551 million by 2027, at a CAGR of 7.4% between 2022 and 2027.
Increasing demand for electric vehicles, government incentives and schemes, and miniaturization of electronic components are key factors for the growth of the bonding sheet market. Additionally, the development of the telecommunication industry is expected to offer significant growth opportunities to the bonding sheet manufacturers. However , high capital investment and geopolitical uncertainties is expected to restrict the growth of the market. The major challenge faced by players is stringent environmental regulation and impact of moisture on bonding sheets.
In terms of value, the polyimide adhesive material segment is projected to account for the largest share of the bonding sheet market, by adhesive material, during the forecast period.
Polyimide bonding sheets possess high tensile strength and dimensional stability with chemical and heat resistant properties. Polyimide bonding sheets have applications in electronics/optoelectronics, telecommunication, automotive, and other end-use industries for flexible printed circuits, multi-layer FPCs, and bonding of materials such as camera modules & lens mounting, RF modules, and stiffeners.
25m (1mil) adhesive thickness segment accounted for the largest market share in the bonding sheet market
Adhesive thickness ensures the bonding strength of adhesive and coverage over a bonding surface. Demanding electronics applications such as adhesion of flexible circuits to rigid boards, rigid-flex circuits, multi-layer FPCs utilize this type of bonding sheet for the development of electronics products. Moreover, it allows multiple lamination cycles and provides superior bonding strength for electronics materials.
The electronics/optoelectronics application segment is estimated to account for the largest share in the bonding sheet market
The development of consumer electronics devices with the integration of artificial intelligence (AI), internet of things (IoT), and emerging trends of smart devices is increasing the demand for bonding sheets for electronics/optoelectronics applications. Additionally, the development of emerging telecommunication technologies are also significant drivers for…
Full story available on Benzinga.com
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