Aehr Test Systems will participate in the Craig-Hallum Institutional Investor Virtual Conference on June 2, 2021

Fremont, California, May 28, 2021 (Global News Agency)- Aehr test system (Nasdaq:AEHR), a global supplier of semiconductor testing and reliability qualification equipment, today announced that it will participate in 18^day The annual Craig-Hallum Institutional Investor Virtual Conference will be held on Wednesday, June 2, 2021. Aehr Test President and CEO Gayn Erickson and CFO Ken Spink will hold virtual meetings with investors throughout the day.

“We look forward to discussing with investors our semiconductor wafer-level and individual chip testing and burn-in solutions and the markets they serve,” said Mr. Eriksson. “Aehr Test provides complete production solutions to improve the yield and reliability of semiconductors, as well as silicon carbide semiconductors for electric and hybrid electric vehicles, silicon photonic devices for data centers and 5G infrastructure, and 2D /3D and other sensor devices. Mobile and wearable applications are expected to become important revenue drivers for our products.”

For more information or to arrange a virtual meeting with Aehr’s management, please contact your Craig-Hallum representative or Aehr’s investor relations company MKR Investor Relations at aehr@mkr-group.com.

About Aehr Test System
Headquartered in Fremont, California, Aehr Test Systems is a global supplier of burn-in and test logic, optical and memory integrated circuit test systems, with more than 2,500 systems installed worldwide. The increasing demand for quality and reliability in the automotive and mobile integrated circuit markets has driven additional test requirements, incremental capacity requirements and new opportunities for Aehr test products in packaging, wafer-level and monolithic/module-level testing. Aehr Test has developed and launched a variety of innovative products, including ABTS^{TM value} And FOX-P^{TM value} Test and burn-in system and FOX WaferPak series^{TM value} Aligner, FOX-XP WaferPak contactor, FOX DiePak^® Carrier and FOX DiePak loader. The ABTS system is used for the production and qualification testing of low-power and high-power logic devices and packaging components of all common types of memory devices. FOX-XP and FOX-NP systems are full-wafer contact and single chip/module testing and burn-in systems, used for burn-in and functional testing of complex devices, such as cutting-edge memories, digital signal processors, microprocessors, microcontrollers, System-on-chip and integrated optics. The FOX-CP system is a new low-cost single-chip compact test and reliability verification solution suitable for logic, memory and photonic devices. It is the latest member of the FOX-P product series. The WaferPak contactor contains a unique full-wafer probe card capable of testing wafers up to 300 mm long, enabling IC manufacturers to perform full-wafer testing and burn-in on the Aehr Test FOX system. DiePak Carrier is a reusable temporary package that enables IC manufacturers to perform cost-effective final testing and burn-in of bare chips and modules. For more information, please visit Aehr Test Systems’ website: www.aehr.com.