[ad_1]
Membership will drive VeriSilicon’s industrialization of chiplet-based projects and support aim of becoming a leading provider of commercialized chiplets globally
VeriSilicon (688521.SH), a leading Silicon Platform as a Service (SiPaaS®) company, today announced it has officially joined the Universal Chiplet Interconnect Express (UCIe) industry consortium. VeriSilicon is one of the first enterprises in mainland China to join the organization and will work with other members on research and adoption of the UCIe 1.0 Specification and the next generation of UCIe technology. VeriSilicon’s participation will support development of its chiplet-based technology and associated products.
The UCIe industry consortium was founded last month by Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company to promote the standardization of chiplet interface specifications. The consortium has already ratified the UCIe 1.0 Specification. UCIe is an open specification that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level.
According to the latest IPnest statistics1VeriSilicon ranked 1st in mainland China and 7th worldwide among semiconductor IP suppliers, while also ranking 2nd in growth rate and ranking within the…
Full story available on Benzinga.com
[ad_2]
Source link
